3D AOI device for substrate assembly 'MV-6 EM OMNI'
This is a 3D AOI device for substrate mounting that achieves a reduction in excessive detection.
The 3D AOI device for substrate assembly, "MV-6 EM OMNI," is a 3D AOI device that achieves a reduction in excessive detection. It projects moiré fringe light onto the mounted components and captures the reflected light with a camera. The height of the components can be measured from the phase shift of that light (reflective phase shift moiré method). Utilizing this principle, it measures the height of components and IC leads. Inspections for component lifting, IC lead lifting, and missing parts are conducted based on the differences in height. Compared to conventional 2D inspections, defect detection has significantly improved, thereby reducing the excessive detection issues that were challenges in 2D inspections. 【Features】 ○ OMNI-VISION(R) 2D/3D Inspection Technology ○ Avoidance of moiré fringe scattering effects ○ 8-stage color lighting ○ 10 Mega Pixel Side-Viewer(R) System For more details, please contact us or download the catalog.
- Company：日本ミルテック
- Price：Other
